Established in 1992, the Company now has more than 500 customers in 100 countries around the world.
Airspan offers a wide variety of wireless broadband solutions to meet the needs of Internet Service Providers, Carriers and a number of vertical market segments including Smart Grids, Public Safety, Transportation and Oil & Gas.
Airspan has been at the forefront of developing new wireless standards. Furthermore, by creating in-house expertise in 4G, LTE, WiMAX, Wi-Fi and VoIP, Airspan is able to exploit synergies and come up with innovative products and solutions that closely integrate these technologies in the most beneficial ways for customers.
The candidate will work in a team at a time-constrained environment, and will interface mechanical, SW,PLM, RF, Algorithmic, and Engineering teams.
At least 5 years’ experience.אלקטרוניקה וחומרה
מהנדס אלקטרוניקה | אלקטרוניקה וחומרה
Experience in board design with the following technologies
a. Embedded Processors/Network Processors
b.High speed Transceivers.
c.Ethernet Switch, Ethernet PHYs, SGMII/1000Base-X/1000Base-T, 10GBE , XAUI, KR.
d.DDR3/4, Flash, eMMC
e.Large scale FPGA’s.
f.Power supplies – LDO’s, Switching DC-DC
g.I2C, SPI, RS485, MDC/MDIO
Must know: Orcad, Allegro, Signal Integrity, manage multiple layers layout at a highly condensed board.
Experience with Intel x86 CPU design – Advantage.
Good knowledge of networking.
Experience in FPGA design (Verilog/VHDL) – Advantage.
Knowledge in LTE - advantage
Knowledge in RF - advantage
Motivated and pusher, experienced in running projects independently, including outsourcing.
משרה מספר 6802627